international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.
Palabras clave para buscar:
wafer bumping, wafer bumping contract services, wafer level processing, wafer level packaging contract services, wlp, wafer electroplating, high aspect ratio electroplating, electroplating, ubm, thick photoresist, gold bump, gold bumping, au bumping, solder bumps, solder bumping, tin lead bumps, pillar bumps, copper pillar bumps, copper electroplating, indium bumps, indium bumping, gold/tin bumps, au/sn bumps, au/sn bumping, known good packaging, known good die, advanced chip packaging, tape automated bonding, tab, flipchip, flip chip packaging, bare die packaging, fine pitch bumps, plated vias, plated bumps, bump, bumps, plating, imi, international micro industries, inc., cherry hill, new jersey, nj
Dirección de la empresa :
1951 Old Cuthbert Road - Building 404,HADDONFIELD,NJ,USA
Código postal: Código Postal :
8033
Número de teléfono :
8566160051 (+1-856-616-0051)
Número de fax:
8566160226 (+1-856-616-0226)
Sitio Web:
imi-corp. com
E-mail :
EE.UU. Código SIC ( Clasificación Industrial Estándar Código ) :
copiar y pegar este mapa de Google a su sitio web o blog!
Pulse el botón de copiar y pegar en tu blog o sitio web.
(Por favor, cambie a 'HTML' al modo de desplazamiento en su blog. Examples: WordPress Example, Blogger Example)
Póngase en contacto con el distribuidor potencial, comprador, vendedor, distribuidor , fabricante, exportador, importador
(Compra de entrada , venta, oferta para un producto o servicio)